CHO-FORM®
Chomeric's CHO-FORM material was developed to meet the growing demand for high-speed, high volume application of conductive elastomer seals to metal or plastic housings. It is ideal for cellular handsets, PC cards, compartmentalized enclosures and other tightly packaged commercial electronic devices.
- Up to 60% space saved- Flanges as narrow as 0.030 can be gasketed
- 200MHz to 10GHz with very small gasket beads
- Accuracy for gasket location within 0.001 inch
- Highly compressible gaskets, ideal for limited deflection force
- More than 4 Newtons/cm shear adhesion to common housing substrates
Choices of CH0-FORM® Materials
Cho-Form 2.1
Two-component, thermal cure silicone system. Requires a minimum cure temperature of 266°F. Ag/Cu particle filler makes it the best performing gasket for metallic housings such as aluminum or magnesium castings. Excellent adhesion to a wide variety of substrates, including plated metal film on plastic and conductive plates
Cho-Form 3.0
Two-component, thermal cure silicone system. With Ag/Cu particle filler. Minimum cure temperature is only 185°F. Formulated for painted, plated or metallized plastic housings that will not withstand higher temperature bake. Also provides excellent adhesion to metallic housings.
Cho-Form 4.0
One-component, thermal cure silicone system, with Ni/Graphite filler. Minimum cure temperature is 212°F. A low-cost solution for EMI shielding, it is specially formulated to reduce galvanic activity between the housing and EMI gasket, and for use on outdoor applications requiring long-term corrosion resistance.
