Thermals: CHO-THERM® – T500 Typical Properties
Conduction
| Typical Properties |
T500 |
Test Method |
| Binder |
Silicone |
|
| Filler |
Boron Nitride |
|
| Carrier |
Fiberglass |
|
| Color |
Green |
Visual |
| Thickness, inch |
0.010 |
ASTM D374 |
Thermal
| Typical Properties |
T500 |
Test Method |
| Thermal Impedance @ 300 psi °C-in2/W |
0.19 |
ASTM D5470 |
| Thermal conductivity, W/m-k |
2.07 |
ASTM D5470 |
| Operating Temperatures
Range |
-60 to 200 |
--- |
Electrical
| Typical Properties |
T500 |
Test Method |
| Voltage Breakdown |
5000 |
ASTM D149 |
| Volume Resistivity, ohm-cm |
1 x 1014 |
ASTM D257 |
Mechanical
| Typical Properties |
T500 |
Test Method |
| Tensile Strength, psi |
1000 |
ASTM D412 |
| Tear Strength |
100 |
ASTM D642/td>
|
| Elongation % |
10 |
ASTM D412 |
| Hardness |
82 |
ASTM D2240 |
| Specific Gravity |
1.55 |
ASTM D792 |
| UL Flammability Rating |
File No. 57104 |
QMFFZ2 |
Cho-Therm® T500 Help
Detailed Information