Thermals: THERMFLOW® T725 and T710
Chomerics' THERMFLOW phase-change materials are specifically formulated for use in high performance devices requiring minimum thermal resistance for maximum components reliability. For over 30 years grease has been employed as the interface between a flip chip die and the heat spreader or lid. With the advent of THERMFLOW products, phase-change materials are quickly replacing thermal grease.
THERMFLOW T725 and T710
This inherently tacky, elastomeric phase-change material is .005 inches thick. The T725/T710 material is designed to perform best under application pressures from 5 to 100 psi. It functions as an interface for the backside of a flip chip die in applications where superior thermal performance is required.
Ordering Information
THERMFLOW materials are supplied in several standard formats. (See part numbering system for details) For custom sizes, or specialty die-cut shapes, contact a K.R. Anderson, Inc. salseman for the solution thats right for you. See Typical Properties table for further product details.
Part Number Systems
