Thermals: T-WING® Flexible Heat Spreaders
Chomerics' T-WING heat spreaders are thin, flexible, cooling devices with a high strength pressure-sensitive adhesive for easy attachment to components packages. T-Wing heat spreaders provide an effective method of cooling IC devices in restricted space enviroments where conventional heat sinks can't be used, thereby increasing component reliability.
Applications
T-Wing heat spreader are mounted on hot components such as CPU's to decrease case(and die junction) temperature. The result is enhanced reliability and extended component life. Both standard and custom configurations are offered to suit specific space and cooling needs.
T-Wing heat spreaders offer several benefits:
- Low cost cooling for many package types
- Low profile (.013in) allows use in limited headroom enviroments
- Easy pel and stick adhesion to all surfaces, including packages with residual silicone mold release
- Low application force (<5 psi) minimizes risk of damage to component
- Wide range of standard sizes
- Pliable nature allows conformance to concave or otherwise non-flat surfaces for optimal thermal and mechanical performance
Ordering Information
T-Wing heat spreaders are available in standard packages of 100 parts/pkg. See Part Number System for sizes and correct part number.performance details are shown in the Typical Properties page. For specialty package sizes, contact a K.R. Anderson, Inc. salseman for the solution thats right for you.
Part Number Systems
